DocumentCode :
1794937
Title :
Challenges to the electronics packaging technologies for the volume integration of components in medical tools and instruments
Author :
Wagner, Dietmar ; Schmidt, Benedikt ; Detert, Markus
Author_Institution :
Inst. of Micro & Sensor Syst., Otto-von-Guericke Univ., Magdeburg, Germany
fYear :
2014
fDate :
7-11 May 2014
Firstpage :
448
Lastpage :
452
Abstract :
The electronics packaging in microsystems technology for medical applications includes various tasks. The interdisciplinary approach is the most important basis for the success of a product. For the reliable operation of medical microsystems different factors must be considered. For example the functionalization of a catheter depends on different influence factors. The form factor takes the most important role. For a miniaturized and functional catheter tip, the diameter depends on the medical application. Other factors like the shape, reliability and also the cost must be considered. The paper shows the whole technology carrier of a medical product in relation to the field of electronics packaging. With the help of two examples the requirements for future products will be shown.
Keywords :
biomedical electronics; catheters; electronics packaging; micromechanical devices; reliability; electronics packaging technology; form factor; functional catheter tip; medical instruments; medical microsystem technology; medical product; medical tools; miniaturized catheter tip; reliability; Catheters; Endoscopes; Instruments; Medical diagnostic imaging; Medical treatment; Reliability; Ultrasonic imaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
Type :
conf
DOI :
10.1109/ISSE.2014.6887642
Filename :
6887642
Link To Document :
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