DocumentCode
1794949
Title
Galvanic plating for 3D-MID applications
Author
Kordass, Timo ; Franke, J.
Author_Institution
Inst. for Factory Autom. & Production Syst., Friedrich-Alexander-Univ. Erlangen-Nurnberg, Nuremberg, Germany
fYear
2014
fDate
7-11 May 2014
Firstpage
491
Lastpage
495
Abstract
This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.
Keywords
galvanising; interconnections; laser materials processing; moulding; 3D-MID applications; chemical precipitation; chemical standard plating; coating thickness; galvanic plating; laser direct structuring process; molded interconnected devices; motorcycles; Chemicals; Coatings; Copper; Gold; Nickel; Plastics; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location
Dresden
Type
conf
DOI
10.1109/ISSE.2014.6887650
Filename
6887650
Link To Document