Title :
Hybrid optical/electrical switching in directly connected datacenter networks
Author :
Yawei Yin ; Kanonakis, K. ; Ji, Philip
Author_Institution :
NEC Labs. America, Inc., Princeton, NJ, USA
Abstract :
The direct-connect topology, such as xD (x=3, 4, 5, 6, etc) torus, has been pervasive in High Performance Computing (HPC) platforms and is also appearing in datacenters. This paper discusses prospects and challenges of using the direct-connect topology in HPCs and datacenters, and proposes a new hybrid optical/electrical switching architecture to solve the major challenges such as high end-to-end latencies in multi-hop routing. We developed an OpenFlow-based software defined networking testbed to control both the electrical and optical switching components in such network architecture, and conducted experiments to verify the networking performance of the hybrid optical/electrical direct-connect network. The experimental results show that the hybrid architecture can indeed reduce the network diameter and therefore the end-to-end latency. Applications which require all-to-all communications, such as MapReduce, can greatly benefit from the reduced network diameter and end-to-end latency.
Keywords :
computer centres; computer networks; optical fibre networks; optical switches; parallel processing; telecommunication network routing; telecommunication network topology; HPC platforms; OpenFlow-based software defined networking testbed; direct-connect topology; directly connected data center networks; electrical switching components; end-to-end latency; high performance computing; hybrid optical-electrical direct-connect network; hybrid optical-electrical switching architecture; multihop routing; network diameter; optical switching components; Integrated optics; Optical fiber networks; Optical fibers; Optical switches; Servers; Switching circuits; OpenFlow; datacenter networking; direct-connect topology; hybrid optical/electrical network; software defined network;
Conference_Titel :
Communications in China (ICCC), 2014 IEEE/CIC International Conference on
Conference_Location :
Shanghai
DOI :
10.1109/ICCChina.2014.7008251