Title :
Optimization of downtilts adjustment combining joint transmission and 3D beamforming in 3D MIMO
Author :
Zehua Wei ; Ying Wang ; Wenxuan Lin
Author_Institution :
State Key Lab. of Networking & Switching Technol., Beijing Univ. of Posts & Telecommun., Beijing, China
Abstract :
This paper mainly proposes a downtilts adjustment scheme combining joint transmission (JT) and 3-dimension (3D) beamforming in 3D multiple-input multiple-output (MIMO) communication systems, under the new typical scenario in the 3rd generation partnership project (3GPP) which is defined as urban macro cell with one high-rise per sector (3D UMa-H). In our proposed scheme, the specific downtilts adjustment for cellcenter users and cell-edge users are realized through dynamic vertical beamforming. Moreover, the cell-center users are served by 3D beamforming, while the cell-edge users are served by JT and 3D beamforming, which facilitate to maximize both cell-center users´ and cell-edge users´ throughput. To achieve accurate performance evaluation, 3D spatial channel model (3D SCM) and 2-dimension (2D) planar antenna array structure are also considered in our system-level simulation. Simulation results show that our proposed scheme can achieve about 35% gain on cell average spectral efficiency and 42% gain on cell edge user spectral efficiency compared to traditional 2D MIMO without JT.
Keywords :
MIMO communication; array signal processing; optimisation; planar antenna arrays; 2D planar antenna array structure; 3D MIMO; 3D beamforming; 3D spatial channel model; 3GPP; 3rd generation partnership project; cell average spectral efficiency; cell edge user spectral efficiency; cell-center users; downtilts adjustment scheme; dynamic vertical beamforming; joint transmission; multiple-input multiple-output communication systems; urban macro cell; Antenna radiation patterns; Array signal processing; Joints; MIMO; Solid modeling; Three-dimensional displays;
Conference_Titel :
Communications in China (ICCC), 2014 IEEE/CIC International Conference on
Conference_Location :
Shanghai
DOI :
10.1109/ICCChina.2014.7008371