Title :
Semiconductor innovation into the next decade
Author_Institution :
R&D, & CTO Office, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
Abstract :
Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC´s Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.
Keywords :
monolithic integrated circuits; semiconductor technology; Internet of Things; OIP platform; TSMC; big data analytics; brain wave interfaces/communications; cloud computing; cognitive computing; semiconductor innovation; system scaling; universal translators; CMOS integrated circuits; Ecosystems; Energy efficiency; Stacking; Technological innovation; Three-dimensional displays; Transistors; 3DIC; CMOS; CoWoS; InFO; IoT; Moore´s Law; ecosystem; foundry; platform; sensor; system scaling;
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2014 IEEE Asian
Conference_Location :
KaoHsiung
Print_ISBN :
978-1-4799-4090-5
DOI :
10.1109/ASSCC.2014.7008874
