Title :
Optical micro sensors integration and application
Author :
Morita, Nobutomo ; Sawada, Renshi
Author_Institution :
Grad. Sch. of Syst. Life Sci., Kyushu Univ., Fukuoka, Japan
Abstract :
Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.
Keywords :
Doppler measurement; bio-optics; bioMEMS; blood flow measurement; elemental semiconductors; flow sensors; haemodynamics; integrated optics; integrated optoelectronics; laser applications in medicine; laser velocimeters; micro-optomechanical devices; micromirrors; microsensors; optical sensors; silicon; wafer level packaging; Si; blood flow sensors; cavities; low power consumption; low weight; microelectromechanical systems; microlaser Doppler velocimeter; microoptical encoders; mirrors; optical MEMS chip; optical elements; optical equipment miniaturization; optical microsensors integration; portability; precise alignment; three-dimensional electrodes; through-silicon vias; wafer-level packaging; Blood flow; Doppler effect; Measurement by laser beam; Micromechanical devices; Optical device fabrication; Optical sensors; blood flow; laser Doppler; micro-encoder; optical sensor; system-in-package; wafer-level packaging;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-6194-8
DOI :
10.1109/ICSJ.2014.7009595