Evaluation of thermal interface material with electric capacitance measurement: A new method using metal meshes to present finer surface roughness levels

In electronic devices, the thermal characteristics of thermal interface materials are strongly affected by their heat sink contact conditions. In this study, we evaluate the thermal contact resistance between a heat sink and thermal interface materials and then present heat sink roughness levels using metal meshes. We also confirm the effectiveness of our new method via thermal resistance and electrical capacitance measurement experiments.