High speed LCP board for 28Gbps transmission through 300mm

Author

Kataoka, Ryohei ; Kondo, K. ; Akimich, Jun ; Akiyama, Yoko ; Hashimoto, Koji ; Otsuka, Kanji

Author_Institution

PALAP Project Production Eng.Dept., DENSO Corp., Kusaki, Japan

fYear

2014

fDate

4-6 Nov. 2014

Firstpage

39

Lastpage

42

Abstract

Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length is therefore needed in each layer. We have developed an LCP board with 28Gbps bandwidth along with a 300mm wiring length,. The board can be produced using DENSO´s PALAP process, which is useful for high-density solutions involving more than 100 layers.

Keywords

liquid crystal polymers; printed circuits; PALAP process; bit rate 28 Gbit/s; cloud computing communication; enterprise routers; enterprise servers; fine pitch wiring; high speed LCP board; liquid crystal polymer; magnitude higher bandwidth; size 300 mm; Bandwidth; Copper; Dielectrics; Materials; Rough surfaces; Surface roughness; Wiring; I/O interface wiring; high speed PC board; ultra high speed wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan (ICSJ), 2014 IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4799-6194-8

Type

conf

DOI

10.1109/ICSJ.2014.7009604

Filename

7009604