DocumentCode
1798269
Title
Soldering material for fine PoP (Package on Package)
Author
Hashimoto, Yo ; Nakano, Shunsuke ; Takagi, Kazuyoshi ; Kawamata, Yuji
Author_Institution
Solder Tech. Center, Senju Metal Ind. Co., Ltd., Tokyo, Japan
fYear
2014
fDate
4-6 Nov. 2014
Firstpage
75
Lastpage
78
Abstract
The packages for PoP process will become finer as 0.3mm pitch and it is necessary for solder materials to choice finer powder as Type6 because of the better transfer capability and soldering capability.
Keywords
fine-pitch technology; packaging; soldering; Type6; fine PoP; finer powder; package on package; size 0.3 mm; soldering material; Hip; Joints; Nitrogen; Powders; Soldering; 0.3mm pitch BGA; Soldering; dippable paste;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location
Kyoto
Print_ISBN
978-1-4799-6194-8
Type
conf
DOI
10.1109/ICSJ.2014.7009613
Filename
7009613
Link To Document