Title :
Novel exposure system for FOWLP and MCM photolithopraphy process
Author :
Kitamura, Kokoro ; Nakai, K. ; Matsui, H. ; Nagao, T. ; Norimitsu, Y.
Author_Institution :
SCREEN Holdings Co., Ltd., Kyoto, Japan
Abstract :
Fan-out process is one of the major technologies within WLP(Wafer Level Package), where silicon chips are buried into the mold substrate. (Fan-Out WLP)(Fig.1, 2)[1] We have developed the exposure system applying advantage of direct imaging technology with using no-mask or reticle. The system has the capability of compensating displacement of the chips on the reconfigured substrate. We have been successful that the system was able to do alignment exposure with accuracy of equal or less than 2um at |Ave.| + 3 σ.
Keywords :
multichip modules; photolithography; reticles; substrates; wafer level packaging; MCM photolithography process; alignment exposure; direct imaging technology; exposure system; fan-out WLP; fan-out process; mold substrate; no-mask; reconfigured substrate; reticle; silicon chips; wafer level package; Current measurement; Design automation; Displacement measurement; Position measurement; Resists; Semiconductor device measurement; Substrates; Compensation of chip displacement; Direct imaging; FOWLP; Fan-Out; Maskless; WLP;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2014 IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-6194-8
DOI :
10.1109/ICSJ.2014.7009621
