• DocumentCode
    1799084
  • Title

    Thermal actuated passive bistable MEMS switch

  • Author

    Steiner, H. ; Hortschitz, Wilfried ; Stifter, Michael ; Keplinger, F.

  • Author_Institution
    Center for Integrated Sensorsystems, Danube Univ. Krems, Krems, Austria
  • fYear
    2014
  • fDate
    8-9 May 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A completely passively operating micro-mechanical switch is presented. The switch composes of a thermal actuator and a curved bistable beam. The actuator comprises V-shaped beams and a lever transmission. It is designed to operate passive only relying on the thermal expansion of the active material (electroplated Ni) and the temperature changes of the surrounding environment, where the temperature ranges from 40°C up to +50°C. The actuator exhibits a temperature dependent deflection sensitivity of 0.9 μm/K and sufficient force to push the bistable beam into is secondary position. Both subsystems are connected via a latching mechanism. A temperature difference of at least 35 K is required for activation of the switch. A self tailored measurement setup is used to quantify the temperature dependent deflections by means of an optical principle. The measured results are in good agreement with results of numerical simulations and analytical models.
  • Keywords
    beams (structures); microactuators; microswitches; thermal expansion; V-shaped beams; active material; analytical models; curved bistable beam; latching mechanism; lever transmission; numerical simulations; optical principle; passively operating micromechanical switch; self tailored measurement setup; temperature 40 degC to 50 degC; temperature changes; temperature dependent deflection sensitivity; thermal actuated passive bistable MEMS switch; thermal expansion; Actuators; Force; Optical switches; Stress; Temperature measurement; Temperature sensors; Bistable Beam; Electroplated Ni; Micro-mechanical Switch; Passive; Thermal Actuator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Systems Symposium (MESS), 2014
  • Conference_Location
    Vienna
  • Type

    conf

  • DOI
    10.1109/MESS.2014.7010249
  • Filename
    7010249