• DocumentCode
    1799113
  • Title

    The application of heat supply information network platform based on C/S and B/S models

  • Author

    Wenbiao Wang ; Qi Cai ; Siyuan Wang ; Xudong Wang

  • Author_Institution
    Sch. of Inf. Sci. & Technol., Dalian Maritime Univ., Dalian, China
  • fYear
    2014
  • fDate
    18-20 Aug. 2014
  • Firstpage
    301
  • Lastpage
    306
  • Abstract
    Aiming at the problems of some heat supply systems for the measuring points are widely distributed and the data transferring protocols are various, so it´s difficult to summarize the heat supply information data. Therefore, some unified communication protocols and network interfaces were used to improve the problems of the heat supply systems in this paper. In this paper, C/S and B/S models were used to build the heat supply information network platform, KingView and WinCC configuration software were used to monitor the heat supply data, Modbus and OPC communication protocols were used to achieve the tasks of the heat supply data transferring between the clients and the servers. Finally, the heat supply data were published on the Internet by Web, it´s really convenient for the managers to browse the heat supply information and guide the heating supply so as to improve the heat supply quality.
  • Keywords
    Internet; data communication; heat systems; protocols; B/S models; C/S models; Internet; KingView configuration software; Modbus; OPC communication protocols; WinCC configuration software; World Wide Web; data transferring protocols; heat supply data transferring; heat supply information data; heat supply information network platform; heat supply quality; heat supply systems; network interfaces; unified communication protocols; Browsers; Heat transfer; Heating; Protocols; Web servers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Control and Information Processing (ICICIP), 2014 Fifth International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-1-4799-3649-6
  • Type

    conf

  • DOI
    10.1109/ICICIP.2014.7010267
  • Filename
    7010267