Title :
The effect of conductor roughness in high speed printed circuit board design
Author_Institution :
Telecommun. Dept., “Politeh.” Univ. of Bucharest, Bucharest, Romania
Abstract :
In the design phase the interconnects used in high data rate circuits need to be properly considered as transmission lines. This holds true whether they are on external or internal layers, with different effects to be considered. This paper proposes an overview on the effect of conductor roughness from signal integrity perspective, solutions on how to model the conductor´s profile and when it is needed.
Keywords :
printed circuit design; printed circuit interconnections; transmission lines; conductor roughness effect; high data rate circuits; high speed printed circuit board design; transmission lines; Conductors; Dielectrics; Integrated circuit interconnections; Microstrip; Rough surfaces; Surface impedance; Surface roughness; high speed design; models; profile; signal integrity; surface roughness;
Conference_Titel :
Electronics and Telecommunications (ISETC), 2014 11th International Symposium on
Conference_Location :
Timisoara
Print_ISBN :
978-1-4799-7266-1
DOI :
10.1109/ISETC.2014.7010747
