• DocumentCode
    180031
  • Title

    Development of low-temperature sintering technique for plastic dye-sensitized solar cells

  • Author

    Shungo Zen ; Ono, R. ; Oda, T.

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • fYear
    2014
  • fDate
    5-9 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Dye-sensitized solar cell (DSSCs) requires sintering of TiO2 photoelectrode at 450~550 °C to be manufactured. However, the high-temperature sintering is disadvantageous because it limits the use of materials that cannot withstand high temperatures. In our previous work, we proposed plasma and low-pressure mercury (Hg) lamp ultraviolet (UV) treatments of the TiO2 electrode to reduce the sintering temperature by half. It was concluded that the effect of the surface treatment is due to reactive oxygen species (O3, O, OH) produced by the plasma and UV light. In this paper, we propose a new technique for TiO2 photoelectrode, which can reduce the sintering temperature from 450°C to 150°C. We were also succeeded in manufacturing plastic DSSC at 150-°C sintered by using the new technique. The conversion efficiency of plastic DSSC was 2.9 %.
  • Keywords
    dye-sensitised solar cells; electrodes; low-temperature techniques; plastics; sintering; surface treatment; titanium compounds; TiO2; UV treatment; lamp ultraviolet treatment; low-pressure mercury; low-temperature sintering technique; photoelectrode; plasma; plastic DSSC manufacturing; plastic dye-sensitized solar cell; reactive oxygen; sintering temperature; surface treatment; temperature 450 C to 150 C; Decision support systems; Dielectrics; Discharge plasma; Electrodes; Photovoltaic cells; Plasma temperature; Solar cells; Substrates; Dielectric barrier discharge plasma; Dye-sensitized solar cell; Low-temperature sintering; Ultraviolet;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 2014 IEEE
  • Conference_Location
    Vancouver, BC
  • Type

    conf

  • DOI
    10.1109/IAS.2014.6978346
  • Filename
    6978346