DocumentCode
1801860
Title
Development of the three dimensional multi-electrode array for neural recording
Author
Chu, Huai-Yuan ; Kuo, Tzu-Ying ; Fang, Weileun ; Chang, Baowen ; Lu, Shao-Wei ; Chiao, Chuan-Chin
Author_Institution
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
2
fYear
2005
fDate
5-9 June 2005
Firstpage
1804
Abstract
A novel method has been developed for the manufacture of a three dimensional multi-electrode array (3D MEA), particularly, the shape of micro-tips can be varied by MEMS technology to construct different multi-electrode array. It improved the disadvantage of single electrode, which meant that it was available for multi recording and analysis of a series of signals. Overcome the difficulty of making interconnection line on 3D MEA chips via innovative fabrication process design. Use local isolation and removal of oxide films to forming electrodes and interconnections with oxide isolation covers. A 10×10 3D MEA with a distance of 100 μm between each other for further bio-neural signals was demonstrated, and a test on rabbit retina was also available. Besides, integrating pre-amplifier and built-in resistors with 3D MEA was brought out to hopefully increase the efficiency of sensing.
Keywords
microelectrodes; micromechanical devices; neurophysiology; 100 micron; 3D multi-electrode array; MEMS technology; SOI wafer; bio-neural signals; built-in resistors; integrated pre-amplifier; local isolation; microtips shape; multirecording; neural recording; retinal neurons recording; signal analysis; Electrodes; Fabrication; Isolation technology; Manufacturing; Micromechanical devices; Process design; Rabbits; Shape; Signal analysis; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN
0-7803-8994-8
Type
conf
DOI
10.1109/SENSOR.2005.1497444
Filename
1497444
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