• DocumentCode
    1802121
  • Title

    Work in progress — Technology and Global Issues: A non-traditional course in the engineering curriculum

  • Author

    Billis, Steven

  • Author_Institution
    New York Inst. of Technol., New York, NY, USA
  • fYear
    2010
  • fDate
    27-30 Oct. 2010
  • Abstract
    Traditionally, many Engineering programs create a one semester course in a lecture/dialogue format to demonstrate that their students attain the “soft” ABET outcomes (f), (h) and (j) However, it is often the case that upon completion of this course, students are unable to demonstrate: critical/analytical thinking skills, ethical/moral and civic engagement, a global perspective/world view. As a result, graduating engineers have not gained a fuller understanding of the responsibilities of citizenship. In 2005, NYIT initiated NYIT 2030. A key initiative of NYIT 2030 was a new “Discovery Core Curriculum”. As a result, all students must choose one course from each of four seminar categories. These core seminars are guided by three principles: Active Learning; Interdisciplinary and Discipline Specific Content; Research projects that are writing intensive. This presented the School of Engineering and Computing Sciences (SoECS) with the opportunity to create a new Core seminar IENG 400 “Technology and Global Issues” that would engage students more fully. This paper will describe the work, guided by the three principles of a core seminar, that has been completed so far.
  • Keywords
    educational courses; educational technology; engineering education; School of Engineering and Computing Sciences; SoECS; discovery core curriculum; engineering curriculum; engineering programs; nontraditional course; Context; Economics; Educational institutions; Ethics; Guidelines; Seminars; Writing; ABEToutcomes (f, h, j); Active/collaborative learning; Assessment; Critical/analytical thinking skills; Ethics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference (FIE), 2010 IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0190-5848
  • Print_ISBN
    978-1-4244-6261-2
  • Electronic_ISBN
    0190-5848
  • Type

    conf

  • DOI
    10.1109/FIE.2010.5673118
  • Filename
    5673118