Title :
Wetting balance evaluation by SP tension method for Pb free solder paste
Author :
Ogata, Shigeyuki ; Kanai, Masayuki ; Takei, Toshiyasu
Author_Institution :
Dept. of Adv. Ind. Eng., Oki Electr. Ind. Co. Ltd., Takasaki, Japan
Abstract :
Recent studies have provided Pb-free solder and soldering technology for use in electronic assemblies for interconnections in order to avoid water pollution due to the Pb in Sn-Pb solder. Pb-free solder characteristics must be evaluated rapidly and exactly for use in real products. This paper describes a new evaluation method for the wetting balance test of Pb-free solder alloys for use in reflow soldering processes
Keywords :
assembling; environmental factors; printed circuit manufacture; printed circuit testing; reflow soldering; wetting; Pb; Pb free solder paste; Pb-free solder; Pb-free solder alloys; Pb-free solder characteristics; Pb-free soldering technology; SP tension method; Sn-Pb solder; SnPb; electronic assemblies; evaluation method; interconnections; reflow soldering process; solder paste; solder paste tension method; water pollution; wetting balance evaluation; wetting balance test; Bismuth; Cobalt alloys; Copper alloys; Integrated circuit interconnections; Printed circuits; Soldering; Testing; Tin; Water pollution; Zinc;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704708
