• DocumentCode
    1802390
  • Title

    Thermally stable micro hot wire sensor with Borofloat glass membrane

  • Author

    Song, Kap-Duk ; Bang, Jung-Il ; Lee, Sang-Rok ; Lim, Yang-Rye ; Lee, Sang-Mun ; Joo, Byung-Su ; Lee, Yun-Su ; Oyabu, Takashi ; Lee, Duk-Dong

  • Author_Institution
    Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., South Korea
  • Volume
    2
  • fYear
    2005
  • fDate
    5-9 June 2005
  • Firstpage
    1903
  • Abstract
    We report on the fabrication and characteristics of micro hot wire sensor with Borofloat glass membrane on diaphragm by using anodic bonding. Borofloat membrane was thermally stable and strong for mechanical stress. The four types of sensing materials SnO2, In2O3 and mixed oxide of adequate ratio with these two type metal oxide semiconductor were prepared by thermal evaporation method and then oxidized at 600 °C, 3 hrs. Various sensing materials for NOx, CO, etc. were prepared. And then the response characteristics were investigated. For mixed oxide semiconductor with Sn and In oxide, these showed the high sensitivity for NOx and CO gas. And by using the Borofloat glass substrate, the power consumption was much reduced about 60 mW in condition of the best sensitivity.
  • Keywords
    MIS devices; borosilicate glasses; evaporation; gas sensors; indium compounds; membranes; microsensors; thermal stability; tin compounds; 3 hrs; 600 C; Borofloat glass membrane; Borofloat glass substrate; In2O3; SnO2; anodic bonding; mechanical stress; metal oxide semiconductor; micro gas sensor; micro hot wire sensor; mixed oxide semiconductor; power consumption; sensing material; thermal evaporation method; thermal stability; Biomembranes; Bonding; Fabrication; Glass; Mechanical sensors; Semiconductor materials; Sensor phenomena and characterization; Thermal sensors; Thermal stresses; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
  • Print_ISBN
    0-7803-8994-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2005.1497469
  • Filename
    1497469