DocumentCode
1802390
Title
Thermally stable micro hot wire sensor with Borofloat glass membrane
Author
Song, Kap-Duk ; Bang, Jung-Il ; Lee, Sang-Rok ; Lim, Yang-Rye ; Lee, Sang-Mun ; Joo, Byung-Su ; Lee, Yun-Su ; Oyabu, Takashi ; Lee, Duk-Dong
Author_Institution
Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., South Korea
Volume
2
fYear
2005
fDate
5-9 June 2005
Firstpage
1903
Abstract
We report on the fabrication and characteristics of micro hot wire sensor with Borofloat glass membrane on diaphragm by using anodic bonding. Borofloat membrane was thermally stable and strong for mechanical stress. The four types of sensing materials SnO2, In2O3 and mixed oxide of adequate ratio with these two type metal oxide semiconductor were prepared by thermal evaporation method and then oxidized at 600 °C, 3 hrs. Various sensing materials for NOx, CO, etc. were prepared. And then the response characteristics were investigated. For mixed oxide semiconductor with Sn and In oxide, these showed the high sensitivity for NOx and CO gas. And by using the Borofloat glass substrate, the power consumption was much reduced about 60 mW in condition of the best sensitivity.
Keywords
MIS devices; borosilicate glasses; evaporation; gas sensors; indium compounds; membranes; microsensors; thermal stability; tin compounds; 3 hrs; 600 C; Borofloat glass membrane; Borofloat glass substrate; In2O3; SnO2; anodic bonding; mechanical stress; metal oxide semiconductor; micro gas sensor; micro hot wire sensor; mixed oxide semiconductor; power consumption; sensing material; thermal evaporation method; thermal stability; Biomembranes; Bonding; Fabrication; Glass; Mechanical sensors; Semiconductor materials; Sensor phenomena and characterization; Thermal sensors; Thermal stresses; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN
0-7803-8994-8
Type
conf
DOI
10.1109/SENSOR.2005.1497469
Filename
1497469
Link To Document