• DocumentCode
    180477
  • Title

    Power Amplifier Design Optimized for Envelope Tracking

  • Author

    Collins, Gayle Fran ; Fisher, Jonathan ; Radulescu, Fabian ; Barner, Jeff ; Sheppard, Scott ; Worley, Rick ; Kimball, Don

  • Author_Institution
    MaXentric Technol., La Jolla, CA, USA
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we present the design of an inverse Class F power amplifier GaN MMIC, specifically designed for an envelope-tracking application. Power transistors are not typically characterized for the drain modulation that is fundamental to envelope tracking, and the available device models are not usually validated over the required drain bias range. Here, we used fundamental load-pull to characterize a 6×100μm GaN HEMT device over the range of drain bias voltages that would be used in the envelope-tracking PA. This data was scaled to an 8×100μm device to achieve the target output power, and these empirical load-pull models were then used in the design of the power MMIC along with harmonic design in simulation. A total of eight 8×100 μm HEMTs were used in the final design, achieving a maximum power output of 32 W at 10 GHz with a drain efficiency of greater than 45% in back-off, on a die size of less than 4 × 4 mm2 under envelope tracking.
  • Keywords
    III-V semiconductors; MMIC power amplifiers; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaN; HEMT device; MMIC amplifier design; drain bias voltages; drain modulation; empirical load-pull models; envelope-tracking PA; envelope-tracking application; frequency 10 GHz; harmonic design; inverse class F power amplifier; Gallium nitride; Harmonic analysis; Impedance; MMICs; Modulation; Power amplifiers; Power generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE
  • Conference_Location
    La Jolla, CA
  • Type

    conf

  • DOI
    10.1109/CSICS.2014.6978573
  • Filename
    6978573