Title :
Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102)
Abstract :
The following topics were dealt with: interconnect reliability; inorganic dielectric integration; circuit performance; CMP; advanced interconnects; silicides and diffusion barriers; organic materials; and copper interconnect
Keywords :
chemical mechanical polishing; diffusion barriers; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; CMP; advanced interconnects; copper interconnect; diffusion barriers; inorganic dielectric integration; interconnect reliability; organic materials; silicides;
Conference_Titel :
Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-4285-2
DOI :
10.1109/IITC.1998.704731
