Title :
Interconnection challenges and the National Technology Roadmap for Semiconductors
Author :
Chang, Chi Shih ; Monnig, Kenneth A. ; Melliar-Smith, Mark
Author_Institution :
SEMATECH, Austin, TX, USA
Abstract :
For the past 40 years, the semiconductor industry has made extraordinary productivity improvements through the incremental development of the basic technology invented several decades ago. However, we now approach a decade of nonincremental technology changes, many of which are affecting the area of interconnection technology. The industry´s ability to ramp copper/low-k technologies and develop cost-effective flip-chip packaging, will be crucial to the continued productivity improvements and revenue growth for the industry. Following the introduction of copper/low-k, the industry also needs to be prepared to work on design and architecture solutions, since material improvements are less likely to be cost effective, at least in the near term
Keywords :
dielectric thin films; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; permittivity; strategic planning; Cu; IC architecture; IC design; National Technology Roadmap for Semiconductors; copper/low-k interconnect technology; cost-effective flip-chip packaging; interconnection technology; nonincremental technology changes; productivity; revenue growth; semiconductor industry; Cost function; Delay; Dielectric materials; Dielectric substrates; Impedance; Integrated circuit interconnections; Manufacturing industries; Physics; Signal design; Wiring;
Conference_Titel :
Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-4285-2
DOI :
10.1109/IITC.1998.704736