• DocumentCode
    1805460
  • Title

    Interconnection challenges and the National Technology Roadmap for Semiconductors

  • Author

    Chang, Chi Shih ; Monnig, Kenneth A. ; Melliar-Smith, Mark

  • Author_Institution
    SEMATECH, Austin, TX, USA
  • fYear
    1998
  • fDate
    1-3 Jun 1998
  • Firstpage
    3
  • Lastpage
    6
  • Abstract
    For the past 40 years, the semiconductor industry has made extraordinary productivity improvements through the incremental development of the basic technology invented several decades ago. However, we now approach a decade of nonincremental technology changes, many of which are affecting the area of interconnection technology. The industry´s ability to ramp copper/low-k technologies and develop cost-effective flip-chip packaging, will be crucial to the continued productivity improvements and revenue growth for the industry. Following the introduction of copper/low-k, the industry also needs to be prepared to work on design and architecture solutions, since material improvements are less likely to be cost effective, at least in the near term
  • Keywords
    dielectric thin films; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; permittivity; strategic planning; Cu; IC architecture; IC design; National Technology Roadmap for Semiconductors; copper/low-k interconnect technology; cost-effective flip-chip packaging; interconnection technology; nonincremental technology changes; productivity; revenue growth; semiconductor industry; Cost function; Delay; Dielectric materials; Dielectric substrates; Impedance; Integrated circuit interconnections; Manufacturing industries; Physics; Signal design; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-4285-2
  • Type

    conf

  • DOI
    10.1109/IITC.1998.704736
  • Filename
    704736