Title :
Industry challenges for system-on-a-chip
Author_Institution :
Semicond. Div., Siemens AG, Munich, Germany
Abstract :
A number of intensifying developments in the electronics and computing industry reflect the need for a rethink of design methodologies and an aggressive redistribution of resources on the part of systems houses, and both semiconductor and EDA vendors. The challenges presented to the industry and some of the actions taken by Siemens Semiconductors Group are presented here, including process technology, high level design, verification and test, design for interconnect, and organisational change
Keywords :
circuit CAD; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; manufacturing resources planning; microprocessor chips; EDA vendors; computing industry; design for interconnect; design methodologies; design test; design verification; electronics industry; high level design; organisational change; process technology; resource redistribution; semiconductor vendors; system-on-a-chip; systems houses; Algorithm design and analysis; Design methodology; Design optimization; Electronic design automation and methodology; Embedded system; Field programmable gate arrays; Libraries; Random access memory; Reconfigurable logic; System-on-a-chip;
Conference_Titel :
Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-4285-2
DOI :
10.1109/IITC.1998.704738
