• DocumentCode
    1806811
  • Title

    6T SRAM and 3T DRAM data retention and remanence characterization in 65nm bulk CMOS

  • Author

    Cakir, Cagla ; Bhargava, Mudit ; Mai, Ken

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2012
  • fDate
    9-12 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    While SRAM and DRAM are often assumed to have very small data retention times (bits are lost immediately at power-down) and no data remanence (stored bits leave no traces even after a prolonged storage period), under some conditions these assumptions do not hold. Both retention and remanence have been exploited by malicious attackers to compromise system data and encryption keys in secure systems. To precisely measure retention and remanence in SRAM and DRAM, we implemented specially instrumented 6T SRAM and 3T DRAM test structures in 65nm bulk CMOS and tested them from -40°C to 85°C and under accelerated aging conditions. Results show that the 50% retention time (i.e., half the bits retained data) is 44 ms for the 6T SRAM and 3.8 ms for the 3T DRAM at -40°C. Further, the data remanence effects were exploited to predict stored bits with over 82% accuracy for 22% of a 4kb SRAM array.
  • Keywords
    CMOS integrated circuits; DRAM chips; SRAM chips; cryptography; 3T DRAM; 6T SRAM; bulk CMOS; data remanence; data retention; encryption keys; size 65 nm; temperature -40 C to 85 C; time 3.8 ms; time 44 ms; Arrays; Instruments; Radiation detectors; Random access memory; Remanence; Stress; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2012 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4673-1555-5
  • Electronic_ISBN
    0886-5930
  • Type

    conf

  • DOI
    10.1109/CICC.2012.6330672
  • Filename
    6330672