Title :
Schottky diodes in CMOS for terahertz circuits and systems
Author :
Yarning Zhang ; Ruonan Han ; Youngwan Kim ; Dae Yeon Kim ; Shichijo, H. ; Sankaran, S. ; Chuying Mao ; Eunyoung Seok ; Dongha Shim ; Kenneth, K.O.
Author_Institution :
Dept. of EE, Univ. of Texas, Dallas, TX, USA
Abstract :
Using Polysilicon Gate Separated Schottky Diode structures that can be fabricated without any process modifications in a foundry digital 130-nm CMOS process, cut-off frequency of ~2 THz has been measured. In addition, exploiting the complementary of CMOS technology, an anti-parallel diode pair with cut-off frequency of ~660 GHz consisting of an n-type and a p-type Schottky diode has been demonstrated in the same 130-nm CMOS process. Using the diodes, a frequency doubler and a tripler have been demonstrated. Additionally, the diodes have been utilized to implement 280-GHz and 860-GHz detectors for imaging. A fully-integrated 280-GHz 4×4 imager array exhibits measured NEP of 29pW/Hz½ and responsivity of 5.1kV/W (323V/W without the amplifier). The 860-GHz detector without an amplifier achieves responsivity of 355V/W and NEP of 32pW/Hz½. The NEP at 860GHz is 2X better than the best reported performance of MOSFET-based imagers without a silicon lens attached to the chip.
Keywords :
CMOS integrated circuits; Schottky diodes; millimetre wave detectors; submillimetre wave detectors; terahertz wave detectors; CMOS process; Schottky diodes; antiparallel diode pair; frequency 280 GHz; frequency 860 GHz; polysilicon gate separated schottky diode structures; process modifications; terahertz circuits; wavelength 130 nm; CMOS integrated circuits; CMOS process; Detectors; Imaging; Schottky barriers; Schottky diodes; CMOS; Millimeter wave; Schottky barrier diode; Sub-millimeter wave; Terahertz; frequency multiplication; imager;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2013 IEEE 13th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4673-1552-4
Electronic_ISBN :
978-1-4673-1551-7
DOI :
10.1109/SiRF.2013.6489420