DocumentCode
1807653
Title
Impact of interconnect performances on circuit design
Author
Schoellkopf, Jean-Pierre
Author_Institution
SGS-Thomson Microelectron., Crolles, France
fYear
1998
fDate
1-3 Jun 1998
Firstpage
53
Lastpage
55
Abstract
The evolution of interconnect technologies is presented in terms of density and electrical performance, and compared to the parallel evolution of transistor characteristics and circuit complexity. Definition of “gate delays” and “interconnect delays”, and their evolution, are presented. The increasing impact of interconnect delays is emphasized, together with signal integrity problems and cross-coupling effects. Safe design solutions are presented (when available), and interconnect technology evolution is suggested, or required, to solve new problems which are approaching due to increased operating frequency and reduced power supply voltage. Trade-offs between interconnect resistances (vias and wires), capacitances (intra and inter layer) and their impact on performance are discussed. As a conclusion, the main requirements for interconnect technology evolution are presented from a circuit design viewpoint
Keywords
capacitance; circuit complexity; crosstalk; delays; electric resistance; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; circuit complexity; circuit design; cross-coupling effects; gate delays; interconnect delays; interconnect density; interconnect electrical performance; interconnect interlayer capacitance; interconnect intralayer capacitance; interconnect performance; interconnect resistance; interconnect technology; interconnect technology evolution; operating frequency; power supply voltage; signal integrity; transistor characteristics; vias; Capacitance; Circuit synthesis; Complexity theory; Delay effects; Frequency; Integrated circuit interconnections; Power supplies; Transistors; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-4285-2
Type
conf
DOI
10.1109/IITC.1998.704749
Filename
704749
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