Title :
Impact of interconnect performances on circuit design
Author :
Schoellkopf, Jean-Pierre
Author_Institution :
SGS-Thomson Microelectron., Crolles, France
Abstract :
The evolution of interconnect technologies is presented in terms of density and electrical performance, and compared to the parallel evolution of transistor characteristics and circuit complexity. Definition of “gate delays” and “interconnect delays”, and their evolution, are presented. The increasing impact of interconnect delays is emphasized, together with signal integrity problems and cross-coupling effects. Safe design solutions are presented (when available), and interconnect technology evolution is suggested, or required, to solve new problems which are approaching due to increased operating frequency and reduced power supply voltage. Trade-offs between interconnect resistances (vias and wires), capacitances (intra and inter layer) and their impact on performance are discussed. As a conclusion, the main requirements for interconnect technology evolution are presented from a circuit design viewpoint
Keywords :
capacitance; circuit complexity; crosstalk; delays; electric resistance; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; circuit complexity; circuit design; cross-coupling effects; gate delays; interconnect delays; interconnect density; interconnect electrical performance; interconnect interlayer capacitance; interconnect intralayer capacitance; interconnect performance; interconnect resistance; interconnect technology; interconnect technology evolution; operating frequency; power supply voltage; signal integrity; transistor characteristics; vias; Capacitance; Circuit synthesis; Complexity theory; Delay effects; Frequency; Integrated circuit interconnections; Power supplies; Transistors; Voltage; Wires;
Conference_Titel :
Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-4285-2
DOI :
10.1109/IITC.1998.704749
