Title :
Future integrated modular avionics for jet fighter mission computers
Author :
Sutterfield, Brian ; Hoschette, John A. ; Anton, Paul
Author_Institution :
MS2 Tactical Syst., Lockheed Martin, Eagan, MN
Abstract :
Highly flexible and versatile computing architectures are needed to meet the ever-changing jet fighter aircraft mission needs with cost-effective processors. Future avionics mission computers will require a continued commitment to open architectures and modular hardware operating at more than two orders of magnitude greater processing than todaypsilas most advanced mission computing solutions. Dense multiplexing busses (optical technology) will be required to interlink multi-core modular processors. Multi-level security will be required to provide safeguards to ensure the integrity of the network. Systems must be architected in a manner that will support open standards while still allowing for ultra high density packaging. Backplanes will contain integrated electrical and optical signals, and progress in modular software development and legacy software reuse will be necessary to maximize the efficiency of integrating new hardware. All technologies required to build the next generation mission computer exist today, and by applying proper focus these technologies can be combined to provide a quantum increase in processing capability with higher reliability and affordable cost.
Keywords :
aerospace computing; avionics; multiprocessing systems; software maintenance; dense multiplexing busses; integrated modular avionics; jet fighter mission computers; legacy software reuse; modular processors; modular software development; ultra high density packaging; Aerospace electronics; Backplanes; Computer architecture; Costs; Hardware; Integrated optics; Military aircraft; Packaging; Programming; Quantum computing;
Conference_Titel :
Digital Avionics Systems Conference, 2008. DASC 2008. IEEE/AIAA 27th
Conference_Location :
St. Paul, MN
Print_ISBN :
978-1-4244-2207-4
Electronic_ISBN :
978-1-4244-2208-1
DOI :
10.1109/DASC.2008.4702749