DocumentCode
1808282
Title
Future integrated modular avionics for jet fighter mission computers
Author
Sutterfield, Brian ; Hoschette, John A. ; Anton, Paul
Author_Institution
MS2 Tactical Syst., Lockheed Martin, Eagan, MN
fYear
2008
fDate
26-30 Oct. 2008
Abstract
Highly flexible and versatile computing architectures are needed to meet the ever-changing jet fighter aircraft mission needs with cost-effective processors. Future avionics mission computers will require a continued commitment to open architectures and modular hardware operating at more than two orders of magnitude greater processing than todaypsilas most advanced mission computing solutions. Dense multiplexing busses (optical technology) will be required to interlink multi-core modular processors. Multi-level security will be required to provide safeguards to ensure the integrity of the network. Systems must be architected in a manner that will support open standards while still allowing for ultra high density packaging. Backplanes will contain integrated electrical and optical signals, and progress in modular software development and legacy software reuse will be necessary to maximize the efficiency of integrating new hardware. All technologies required to build the next generation mission computer exist today, and by applying proper focus these technologies can be combined to provide a quantum increase in processing capability with higher reliability and affordable cost.
Keywords
aerospace computing; avionics; multiprocessing systems; software maintenance; dense multiplexing busses; integrated modular avionics; jet fighter mission computers; legacy software reuse; modular processors; modular software development; ultra high density packaging; Aerospace electronics; Backplanes; Computer architecture; Costs; Hardware; Integrated optics; Military aircraft; Packaging; Programming; Quantum computing;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Avionics Systems Conference, 2008. DASC 2008. IEEE/AIAA 27th
Conference_Location
St. Paul, MN
Print_ISBN
978-1-4244-2207-4
Electronic_ISBN
978-1-4244-2208-1
Type
conf
DOI
10.1109/DASC.2008.4702749
Filename
4702749
Link To Document