DocumentCode

180854

Title

The following topics are dealt with: 3D testing; circuit reliability; resilient circuit design and test; testing of emerging technologies; SoC testing; design, verification, and application of IEEE 1687; post-silicon validation; testability and test generation; yield optimization of memory; on-line parameter testing; power/temperature-aware testing; trojan/fault detection with high resolution; analog/memory testing; big data for test; in-field techniques for performance adaption, test, and power-noise diagnosis; timing variation detection; delay testing; high quality system level test and diagnosis; test compression; and hardware security.

Keywords

data compression; design for testability; fault simulation; integrated circuit design; integrated circuit testing; integrated memory circuits; invasive software; logic testing; system-on-chip; three-dimensional integrated circuits; 3D testing; IEEE 1687; SoC testing; analog testing; circuit reliability; delay testing; emerging technologies; fault detection; hardware security; high quality system level test; in-field techniques; memory testing; online parameter testing; post-silicon validation; power-aware testing; power-noise diagnosis; resilient circuit design; temperature-aware testing; test compression; test generation; timing variation detection; trojan detection; yield optimization;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Symposium (ATS), 2014 IEEE 23rd Asian

Conference_Location

Hangzhou

ISSN

1081-7735

Type

conf

DOI

10.1109/ATS.2014.4

Filename

6979059

Table of contents

conf