DocumentCode
1808714
Title
Analytical study on the capacitive accelerometer´s fingers in microelectromechanical systems (MEMS)
Author
Saharil, Farizah ; Tamsir, Agus Santoso ; Majlis, Burhanuddin Yeop
Author_Institution
Fac. of Eng., Univ. Kebangsaan Malaysia, Selangor, Malaysia
fYear
2002
fDate
19-21 Dec. 2002
Firstpage
552
Lastpage
556
Abstract
This paper presents new analytical study on the capacitive accelerometer´s fingers which utilizes branched comb finger electrode instead of the conventional straight finger electrode. It employs capacitive sensing using overlap-area variation between comb electrode and the suspension beam to provide higher sensitivity without compromising pull-in voltage, full-scale range, or bandwidth besides the ease of fabrication. Mathematical formulations of each structure are derived and analyzed using numerical analysis. Three shapes of finger electrodes, which consist of branched fingers, triangle shaped fingers and semi-circle shaped fingers are compared to obtain the optimal shape with the highest capacitance and sensitivity. The result shows that the semi-circle shaped electrodes have the highest capacitance of 915 fF and sensitivity of -449.4 pF/μm for a single 240 μm×4.6 μm suspension beam with 3 μm structure thickness followed by the triangle shaped fingers with capacitance of 29 fF and -124.7 pF/μm and the branched comb fingers with 42.5 fF and -106.3 pF/μm.
Keywords
accelerometers; capacitive sensors; electrodes; micromechanical devices; microsensors; numerical analysis; 29 fF; 42.5 fF; 915 fF; MEMS; bandwidth; branched comb finger electrode; capacitive accelerometer finger; capacitive accelerometers finger; conventional straight finger electrode; numerical analysis; semicircle shaped finger; triangle shaped finger; Bandwidth; Capacitance; Electrodes; Fabrication; Fingers; Microelectromechanical systems; Micromechanical devices; Numerical analysis; Shape; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2002. Proceedings. ICSE 2002. IEEE International Conference on
Print_ISBN
0-7803-7578-5
Type
conf
DOI
10.1109/SMELEC.2002.1217884
Filename
1217884
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