DocumentCode
180887
Title
Reliability-Driven Pipelined Scan-Like Testing of Digital Microfluidic Biochips
Author
Zipeng Li ; Trung Anh Dinh ; Tsung-Yi Ho ; Chakrabarty, Krishnendu
Author_Institution
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
fYear
2014
fDate
16-19 Nov. 2014
Firstpage
57
Lastpage
62
Abstract
A digital micro fluidic biochip (DMFB) is an attractive platform for immunoassays, point-of-care clinical diagnostics, DNA sequencing, and other laboratory procedures in biochemistry. Effective testing methods are required to ensure robust DMFB operation and high confidence in the outcome of biochemical experiments. Prior work on DMFB testing does not address the problem of designing the test to minimize reliability degradation during test application. It also ignores physical constraints arising from fluidic behavior and the physics of electro wetting-on-dielectric. We develop a practical and realistic testing method by first systematically analyzing the influence of actuation voltage and actuation frequency on the distribution of the electric field, and its resulting effect on dielectric degradation. Next, we use this analysis to choose appropriate parameter settings for testing, and proposes a new pipelined scan-like testing method. Both static and dynamic fluidic constraints are considered in the new testing method, and a diagnosis technique is presented to easily locate defects. Finally, simulation results are presented to demonstrate the effectiveness of the proposed testing approach in minimizing test-completion time.
Keywords
biological techniques; integrated circuit reliability; integrated circuit testing; lab-on-a-chip; microfluidics; DMFB testing; actuation frequency; actuation voltage; diagnosis technique; dielectric degradation; digital micro fluidic biochip; dynamic fluidic constraints; electric field distribution; electro wetting-on-dielectric; fluidic behavior; physical constraints; pipelined scan-like testing method; reliability degradation; static fluidic constraints; test application; test-completion time; Degradation; Dielectrics; Electrodes; Integrated circuit modeling; Reservoirs; Testing; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium (ATS), 2014 IEEE 23rd Asian
Conference_Location
Hangzhou
ISSN
1081-7735
Type
conf
DOI
10.1109/ATS.2014.22
Filename
6979077
Link To Document