DocumentCode :
180912
Title :
Exploit Dynamic Voltage and Frequency Scaling for SoC Test Scheduling under Thermal Constraints
Author :
Li Ling ; Jianhui Jiang
Author_Institution :
Sch. of Software Eng., Tongji Univ., Shanghai, China
fYear :
2014
fDate :
16-19 Nov. 2014
Firstpage :
180
Lastpage :
185
Abstract :
Increasing power density and thermal hotspots has become a major problem for integrated circuits. The problem is exacerbated when applying tests to a System-on-Chip (SoC). Running a test individually may exceed the given temperature threshold. So scheduling tests to reduce the test application time (TAT) while keep the cores thermally safe has become a key issue. Dynamic Voltage and Frequency Scaling (DVFS) has been widely used in modern IC devices to control power and temperature. We exploit such features for thermal-aware test scheduling and propose a method to efficiently determine the scaling factor which leads to optimized TAT without violating the thermal constraints. The proposed method can also be used to efficiently calculate the maximum temperature certain tests can achieve when DVFS is applied. After formulating the problem into an MILP model, experimental results on ITC´02 benchmarks showed that DVFS can be used to deal with power intensive tests efficiently and exploiting such features can achieve up to 16.37% reduction of TAT.
Keywords :
integer programming; integrated circuit testing; linear programming; scheduling; system-on-chip; thermal management (packaging); DVFS; ITC´02 benchmarks; MILP model; SoC; TAT; dynamic voltage and frequency scaling; integrated circuits; modern IC devices; power density; scaling factor; system-on-chip; test application time; thermal constraints; thermal hotspots; thermal-aware test scheduling; Benchmark testing; Cooling; Job shop scheduling; System-on-chip; Temperature; DVFS; SoC test scheduling; thermal-aware;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Symposium (ATS), 2014 IEEE 23rd Asian
Conference_Location :
Hangzhou
ISSN :
1081-7735
Type :
conf
DOI :
10.1109/ATS.2014.36
Filename :
6979097
Link To Document :
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