• DocumentCode
    1810641
  • Title

    Hybrid buck-linear (HBL) technique for enhanced dip voltage and transient response in load-preparation buck (LPB) converter

  • Author

    Shih, Chun-Jen ; Chu, Kuan-Yu ; Lee, Yu-Huei ; Chen, Ke-Horng

  • Author_Institution
    Inst. of Electr. Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    12-16 Sept. 2011
  • Firstpage
    431
  • Lastpage
    434
  • Abstract
    A hybrid buck-linear (HBL) technique in a load-preparation buck (LPB) converter for system-on-a-chip (Soc) is proposed in this paper. In case of the sudden load variation in Soc, the proposed converter with hybrid operation can effectively enhance the transient response with smaller dip voltage and faster transient recovery time. In addition, the high power conversion efficiency can be derived since an auxiliary power switch assures that hybrid operation is only activated in load transient period. Experimental results demonstrate that the improvements of transient dip voltage and recovery time are 53% and 63%, respectively, as well as 8% in efficiency. The chip was fabricated by 0.25 μm CMOS process with a peak efficiency of 95% for Soc applications.
  • Keywords
    CMOS logic circuits; DC-DC power convertors; power aware computing; power conversion; switches; switching convertors; system-on-chip; transient response; CMOS process; HBL technique; LPB converter; SoC; auxiliary power switch; hybrid buck-linear technique; load-preparation buck converter; power conversion efficiency; size 0.25 mum; sudden load variation; system-on-a-chip; transient dip voltage; transient recovery time; transient response; Regulators; Switches; System-on-a-chip; Transient analysis; Transient response; Voltage control; Voltage fluctuations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ESSCIRC (ESSCIRC), 2011 Proceedings of the
  • Conference_Location
    Helsinki
  • ISSN
    1930-8833
  • Print_ISBN
    978-1-4577-0703-2
  • Electronic_ISBN
    1930-8833
  • Type

    conf

  • DOI
    10.1109/ESSCIRC.2011.6044999
  • Filename
    6044999