Numerical modeling and design of Substrate Integrated Waveguide (SIW) components

Substrate Integrated Waveguide (SIW) technology represents the new paradigm for the low-cost and efficient implementation of microwave and mm-wave components and subsystems. SIW structures permit to implement in planar form a variety of waveguide components and antennas, and they also allow for complete system integration in a single substrate, thus avoiding interconnects and packaging issues. This paper presents an overview of the modeling of waveguide interconnects and components by the Boundary Integral-Resonant Mode Expansion (BI-RME) method and its application to the derivation of equivalent circuit models of SIW discontinuities. Design techniques based on the combined use of equivalent circuit models and space-mapping optimization techniques are also addressed.