Title :
Analysis of Lead Free Tin Whisker Test Methodology and Characterization
Author :
Cui, Helen ; Ferrara, Mike ; Mlcak, Matthew
Author_Institution :
RF Micro Devices, Inc., Greensboro, NC
Abstract :
Driven by government environmental directives and market forces, the global electronics industry has continued to migrate toward lead-free electronics. However, a major drawback of using lead-free tin (Sn) finishes is the potential for formation and growth of tin whiskers. In this study, tin whisker characterization tests were conducted on several lead free parts from different package types in accordance to JEDEC standards. Tin whisker test methodology, test challenges, and test results are discussed. Furthermore, the propensity for tin whisker growth has been shown in some research to be potentially influenced by certain plating parameters. Additional analysis was conducted within this characterization sample set in an attempt to better understand the effects of corrosion, plating thickness, and grain size on tin whisker formation. Finally, the potential risks associated with common applications and package types for the compound semiconductor industry were examined
Keywords :
corrosion; electronics industry; electronics packaging; electroplating; grain size; hazardous materials; solders; surface finishing; tin; JEDEC standards; Sn; compound semiconductor industry; corrosion effects; grain size; lead free tin whisker test; lead-free electronics; package types; plating parameters; plating thickness; Consumer electronics; Corrosion; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Government; Grain size; Industrial electronics; Testing; Tin; Corrosion; Grain Size; Plating Thickness; Temperature Cycling Test; Temperature Humidity Test; Tin Whisker;
Conference_Titel :
ROCS Workshop, 2006. [Reliability of Compound Semiconductors]
Conference_Location :
San Antonio, TX
Print_ISBN :
0-7908-0113-2
DOI :
10.1109/ROCS.2006.323403
