DocumentCode :
1811412
Title :
Reliability & Performance of a True Enhancement Mode HIGFET
Author :
Gaw, Craig ; Arnold, Thomas ; Glass, Elizabeth ; Martin, Robert
Author_Institution :
Wireless & Packaging Syst. Lab., Freescale Semicond., Inc., Tempe, AZ
fYear :
2006
fDate :
12-12 Nov. 2006
Firstpage :
75
Lastpage :
92
Abstract :
Freescale\´s true enhancement mode (EMODE) HIGFET is a high performance single supply technology used for wireless power amplifiers. It is the first technology of its kind to be produced in a high volume manufacturing environment. The EMODE HIGFET intrinsic reliability was evaluated using a conventional three temperature DC accelerated stress test. The device used for these tests has a total gate width of 0.6-mm, a gate length of 0.8-mum, a die thickness of 3-mils without through-wafer vias. The device is representative of the unit cell for larger devices and was processed using a production mask set. For targeted applications with a system life of 5-years, the first expected "failure" at 150degC for the 1-ppm level was determined to be 82-years at a 90% lower confidence level, which exceeds the reliability requirements for subscriber unit power amplifiers by a wide margin. This work demonstrates that EMODE HIGFET devices are high performance RF devices with intrinsic reliability well in excess of anticipated system requirements
Keywords :
power amplifiers; power field effect transistors; semiconductor device reliability; 0.6 micron; 0.8 micron; 150 C; 5 yrs; 82 yrs; Freescale; RF devices; production mask set; single supply technology; three temperature DC accelerated stress test; true enhancement mode HIGFET; wireless power amplifiers; High power amplifiers; Life estimation; Manufacturing; Power system reliability; Production; Radio frequency; Radiofrequency amplifiers; Stress; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ROCS Workshop, 2006. [Reliability of Compound Semiconductors]
Conference_Location :
San Antonio, TX
Print_ISBN :
0-7908-0113-2
Type :
conf
DOI :
10.1109/ROCS.2006.323406
Filename :
4118084
Link To Document :
بازگشت