DocumentCode
1811486
Title
Migration of a robotics platform from a freshman introduction to engineering course sequence to a sophomore circuits course
Author
Harbour, Davis ; Hummel, Paul
Author_Institution
Louisiana Tech Univ., Ruston, LA, USA
fYear
2010
fDate
27-30 Oct. 2010
Abstract
Thanks to a grant from the National Science Foundation, Louisiana Tech University has implemented a new freshman engineering sequence of three courses focused on boosting hands-on learning, student confidence and innovation. Every engineering student purchases a robotics kit with a programmable microcontroller, sensors, servos and software along with a toolkit to provide the basis for a mobile laboratory and design platform. An aspect of this Phase II CCLI grant involves the migration of components from the freshmen sequence into our sophomore engineering sequence of courses comprised of statics, circuits and thermodynamics. Three laboratory exercises have been developed for the sophomore circuits course utilizing the robotics platform from the freshman sequence. These three exercises provide additional practice in using hardware and tools introduced in the freshman year and provide important hands-on applications to support fundamental concepts covered in an introductory circuits course. This paper presents details of the three exercises that have been developed, faculty training activities and assessment results.
Keywords
computer aided instruction; educational courses; electrical engineering computing; electrical engineering education; Louisiana tech university; National science foundation; engineering course; faculty training; freshman engineering sequence; hands on learning; introductory circuits course; mobile laboratory; programmable microcontroller; robotics kit; sophomore circuits course; Capacitors; Frequency measurement; Laboratories; Oscilloscopes; Potentiometers; Resistors; Robots; Circuits; Hands-on; Laboratory exercises; Robotics platform;
fLanguage
English
Publisher
ieee
Conference_Titel
Frontiers in Education Conference (FIE), 2010 IEEE
Conference_Location
Washington, DC
ISSN
0190-5848
Print_ISBN
978-1-4244-6261-2
Electronic_ISBN
0190-5848
Type
conf
DOI
10.1109/FIE.2010.5673546
Filename
5673546
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