DocumentCode
18122
Title
Integration Without Disruption: The Basic Challenge of Sensor Integration
Author
Dumstorff, Gerrit ; Paul, Sudipta ; Lang, Walter
Author_Institution
Inst. of Microsensors, -Actuators, & -Syst., Univ. of Bremen, Bremen, Germany
Volume
14
Issue
7
fYear
2014
fDate
Jul-14
Firstpage
2102
Lastpage
2111
Abstract
The basic challenge in embedding sensors in materials is to meet simultaneously two conflicting requirements; on one hand, we want to retrieve sensor data from the material and thus we have to integrate sensors, electronics, and interconnections. On the other hand, sensors are foreign bodies in the material, which may deteriorate its macroscopic properties. This paper discusses several possibilities to integrate sensors in material in a minimal invasive way, avoiding subsequent deterioration of its macroscopic performance. It is our idea to adapt the integrated sensor to the surrounding matrix and to reduce sensors volume to the minimum, which is needed to guarantee the function. This approach is called function scale integration.
Keywords
integrated circuits; intelligent sensors; embedding sensors; function scale integration; sensor integration; Mechanical sensors; Strain; Stress; Wounds; Young´s modulus; Sensor integration; function-scale-integration; functionscale- integration; more than Moore; sensor integration;
fLanguage
English
Journal_Title
Sensors Journal, IEEE
Publisher
ieee
ISSN
1530-437X
Type
jour
DOI
10.1109/JSEN.2013.2294626
Filename
6680605
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