• DocumentCode
    18122
  • Title

    Integration Without Disruption: The Basic Challenge of Sensor Integration

  • Author

    Dumstorff, Gerrit ; Paul, Sudipta ; Lang, Walter

  • Author_Institution
    Inst. of Microsensors, -Actuators, & -Syst., Univ. of Bremen, Bremen, Germany
  • Volume
    14
  • Issue
    7
  • fYear
    2014
  • fDate
    Jul-14
  • Firstpage
    2102
  • Lastpage
    2111
  • Abstract
    The basic challenge in embedding sensors in materials is to meet simultaneously two conflicting requirements; on one hand, we want to retrieve sensor data from the material and thus we have to integrate sensors, electronics, and interconnections. On the other hand, sensors are foreign bodies in the material, which may deteriorate its macroscopic properties. This paper discusses several possibilities to integrate sensors in material in a minimal invasive way, avoiding subsequent deterioration of its macroscopic performance. It is our idea to adapt the integrated sensor to the surrounding matrix and to reduce sensors volume to the minimum, which is needed to guarantee the function. This approach is called function scale integration.
  • Keywords
    integrated circuits; intelligent sensors; embedding sensors; function scale integration; sensor integration; Mechanical sensors; Strain; Stress; Wounds; Young´s modulus; Sensor integration; function-scale-integration; functionscale- integration; more than Moore; sensor integration;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2013.2294626
  • Filename
    6680605