Comparative study of W-plug, Al-plug and Al-dual damascene for 0.18 μm ULSI multilevel interconnect technologies

Author

Kikuta, K. ; Takewaki, T. ; Kakuhara, Y. ; Fujii, K. ; Hayashi, Y.

Author_Institution

NEC Corp., Sagamihara, Japan

fYear

1998

fDate

1-3 Jun 1998

Firstpage

140

Lastpage

142

Abstract

Comparative studies of W-plug, Al-plug and Al dual damascene were carried out for 0.18 μm ULSI multilevel interconnects. The via resistance of Al dual damascene was one-fourth of that of W-plug. Al dual damascene interconnects were found to have misalignment tolerance. The electromigration lifetime of Al dual damascene was 4 times longer than that of conventional W-plug, even though lithography misalignment occurred between the vias and the trench wiring. We developed highly reliable Al dual damascene interconnect technology with 0.56 μm pitch for 0.18 μm design rule ULSIs

Keywords

ULSI; aluminium; electric resistance; electromigration; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; isolation technology; lithography; position control; tungsten; 0.18 micron; 0.56 micron; Al; Al dual damascene interconnect misalignment tolerance; Al dual damascene interconnect reliability; Al dual damascene interconnect technology; Al-dual damascene ULSI multilevel interconnects; Al-plug ULSI multilevel interconnects; IC design rules; ULSI multilevel interconnect technology; ULSI multilevel interconnects; ULSIs; W; W-plug ULSI multilevel interconnects; electromigration lifetime; lithography misalignment; trench wiring; via resistance; vias; Dielectric films; Electromigration; Etching; Fabrication; Laboratories; Metallization; Plugs; Silicon compounds; Ultra large scale integration; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-4285-2

Type

conf

DOI

10.1109/IITC.1998.704773

Filename

704773