• DocumentCode
    1812745
  • Title

    A comparison of MIP-based decomposition techniques and VNS approaches for batch scheduling problems

  • Author

    Klemmt, Andreas ; Weigert, Gerald ; Almeder, Christian ; Mönch, Lars

  • Author_Institution
    Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2009
  • fDate
    13-16 Dec. 2009
  • Firstpage
    1686
  • Lastpage
    1694
  • Abstract
    This research is motivated by a scheduling problem found in the diffusion and oxidation areas of semiconductor wafer fabrication facilities. With respect to some practical motivated process constraints, like equipment dedication and unequal batch-sizes, we model the problem as unrelated parallel batch machines problem with incompatible job families and unequal ready times of the jobs. Our objective is to minimize the total weighted tardiness (TWT) of the jobs. Given that the problem is NP-hard, we propose two different solution approaches. The first approach works with a time window-based mixed integer programming (MIP) decomposition. The second approach uses a variable neighbourhood search (VNS). Using randomly generated test instances, we show that the proposed algorithms outperform common dispatching rules that cannot deal with the given constraints effectively.
  • Keywords
    integer programming; scheduling; semiconductor device manufacture; wafer level packaging; MIP-based decomposition techniques; NP-hard problem; batch scheduling problems; parallel batch machines problem; semiconductor wafer fabrication facilities; total weighted tardiness; variable neighbourhood search; window-based mixed integer programming decomposition; Dispatching; Electronics packaging; Fabrication; Furnaces; Job shop scheduling; Laboratories; Linear programming; Manufacturing; Oxidation; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2009 Winter
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-5770-0
  • Type

    conf

  • DOI
    10.1109/WSC.2009.5429173
  • Filename
    5429173