Title :
Silicon carbide power MOSFETs: Breakthrough performance from 900 V up to 15 kV
Author :
Palmour, John W. ; Cheng, Lin ; Pala, Vipindas ; Brunt, Edward V. ; Lichtenwalner, Daniel J. ; Wang, Guo-Yu ; Richmond, Jim ; O´Loughlin, M. ; Ryu, Sang-Burm ; Allen, Scott T. ; Burk, A.A. ; Scozzie, Charles
Author_Institution :
Cree, Inc., Durham, NC, USA
Abstract :
Since Cree, Inc.´s 2nd generation 4H-SiC MOSFETs were commercially released with a specific on-resistance (RON, SP) of 5 mΩ·cm2 for a 1200 V-rating in early 2013, we have further optimized the device design and fabrication processes as well as greatly expanded the voltage ratings from 900 V up to 15 kV for a much wider range of high-power, high-frequency, and high-voltage energy-conversion and transmission applications. Using these next-generation SiC MOSFETs, we have now achieved new breakthrough performance for voltage ratings from 900 V up to 15 kV with a RON, SP as low as 2.3 mΩ·cm2 for a breakdown voltage (BV) of 1230 V and 900 V-rating, 2.7 mΩ·cm2 for a BV of 1620 V and 1200 V-rating, 3.38 mΩ·cm2 for a BV of 1830 V and 1700 V-rating, 10.6 mΩ·cm2 for a BV of 4160 V and 3300 V-rating, 123 mΩ·cm2 for a BV of 12 kV and 10 kV-rating, and 208 mΩ·cm2 for a BV of 15.5 kV and 15 kV-rating. In addition, due to the lack of current tailing during the bipolar device switching turn-off, the SiC MOSFETs reported in this work exhibit incredibly high frequency switching performance over their silicon counter parts.
Keywords :
power MOSFET; semiconductor device breakdown; silicon compounds; wide band gap semiconductors; bipolar device switching turn-off; breakthrough performance; device design; fabrication processes; high frequency switching performance; high-frequency energy-conversion; high-power energy-conversion; high-voltage energy-conversion; second generation 4H-SiC MOSFETs; silicon carbide power MOSFETs; voltage 900 V to 15 kV; MOSFET; Performance evaluation; Resistance; Silicon; Silicon carbide; Switches; Switching loss;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-4799-2917-7
DOI :
10.1109/ISPSD.2014.6855980