• DocumentCode
    1812970
  • Title

    Application of charge based capacitance measurement (CBCM) technique in interconnect process development

  • Author

    Bothra, Subhas ; Rezvani, G.A. ; Sur, Harlan ; Farr, M. ; Shenoy, J.N.

  • Author_Institution
    Dept. of Technol. Dev., VLSI Technol. Inc., San Jose, CA, USA
  • fYear
    1998
  • fDate
    1-3 Jun 1998
  • Firstpage
    181
  • Lastpage
    183
  • Abstract
    The charge based capacitance measurement (CBCM) technique (Chen et al, IEDM p. 69, 1996) was used in order to measure femto-farad level intermetal capacitances between metal lines in different configurations. The results are presented and compared with the calculated numbers using the Rafael simulation program. These structures are used to evaluate the impact of process changes such as the use of low k dielectric on parasitic interconnect capacitance. The parasitic capacitances are determined by using a variety of interconnect structures with varying line width and spacing. Such measurements with low k materials show that the formation of these materials in small narrow spaces may be quite different from that in wide open areas
  • Keywords
    capacitance measurement; circuit simulation; dielectric thin films; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; permittivity; Rafael simulation program; charge based capacitance measurement technique; interconnect process development; interconnect structures; intermetal capacitance; line spacing; line width; low k dielectric; low k materials; metal line configurations; metal lines; parasitic capacitance; parasitic interconnect capacitance; process change effects; Capacitance measurement; Capacitors; Current measurement; Dielectric materials; Dielectric measurements; Frequency; Parasitic capacitance; Planarization; Testing; Variable structure systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-4285-2
  • Type

    conf

  • DOI
    10.1109/IITC.1998.704785
  • Filename
    704785