• DocumentCode
    181328
  • Title

    Understanding negative bias temperature stress in p-channel trench-gate power MOSFETs by low-frequency noise measurement

  • Author

    Magnone, Paolo ; Barletta, G. ; Traverso, Pier Andrea ; Magri, A. ; Sangiorgi, Enrico ; Fiegna, Claudio

  • Author_Institution
    ARCES, Univ. of Bologna, Cesena, Italy
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    163
  • Lastpage
    166
  • Abstract
    In this paper we analyze LF noise in trench-gate power MOSFETs to investigate the effect of negative bias temperature stress on the gate dielectric quality. We study how the amount of stress time influences both the threshold voltage and the trap density within gate oxide. After the stress, recovery conditions are applied to the device and its properties, in terms of threshold voltage, on-current and trap density, are analyzed. The present study allows to identify permanent and recoverable mechanisms associated to the applied stress.
  • Keywords
    negative bias temperature instability; power MOSFET; semiconductor device noise; LF noise; gate dielectric quality; gate oxide; low-frequency noise measurement; negative bias temperature stress; permanent mechanisms; recoverable mechanisms; recovery conditions; stress time; threshold voltage; trap density; trench-gate power MOSFET; Fluctuations; Logic gates; Low-frequency noise; MOSFET; Noise measurement; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6856001
  • Filename
    6856001