DocumentCode
181328
Title
Understanding negative bias temperature stress in p-channel trench-gate power MOSFETs by low-frequency noise measurement
Author
Magnone, Paolo ; Barletta, G. ; Traverso, Pier Andrea ; Magri, A. ; Sangiorgi, Enrico ; Fiegna, Claudio
Author_Institution
ARCES, Univ. of Bologna, Cesena, Italy
fYear
2014
fDate
15-19 June 2014
Firstpage
163
Lastpage
166
Abstract
In this paper we analyze LF noise in trench-gate power MOSFETs to investigate the effect of negative bias temperature stress on the gate dielectric quality. We study how the amount of stress time influences both the threshold voltage and the trap density within gate oxide. After the stress, recovery conditions are applied to the device and its properties, in terms of threshold voltage, on-current and trap density, are analyzed. The present study allows to identify permanent and recoverable mechanisms associated to the applied stress.
Keywords
negative bias temperature instability; power MOSFET; semiconductor device noise; LF noise; gate dielectric quality; gate oxide; low-frequency noise measurement; negative bias temperature stress; permanent mechanisms; recoverable mechanisms; recovery conditions; stress time; threshold voltage; trap density; trench-gate power MOSFET; Fluctuations; Logic gates; Low-frequency noise; MOSFET; Noise measurement; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location
Waikoloa, HI
ISSN
1943-653X
Print_ISBN
978-1-4799-2917-7
Type
conf
DOI
10.1109/ISPSD.2014.6856001
Filename
6856001
Link To Document