High reliable and thermally conductive stack for high-power module in HEV

Author

Ibukiyama, Masahiro ; Monden, Kenji ; Nonogaki, Ryozo

Author_Institution

Res. Centre, Denki Kagaku Kogyo KK, Tokyo, Japan

fYear

2001

fDate

2001

Firstpage

5

Lastpage

9

Abstract

The high-power module generates considerable heat, and its power density and life are restricted by temperature-rise. The presented integrated stack is suitable for high-power modules in a hybrid electric vehicles (HEV). It consists of Al circuits, AlN ceramic plates and Al-SiC composite plates. As the stack does not include a solder layer between a ceramic substrate and base-plate, the stack decreases the amount of lead (Pb) in the power module. Furthermore the elimination of solder brings not only lower thermal resistance but also high reliability because of elimination of solder crack. We are confident that the stacks are most suitable for high-power modules in HEV

Keywords

aluminium; aluminium compounds; automotive electronics; ceramics; electric vehicles; modules; reliability; silicon compounds; thermal conductivity; thermal resistance; Al; Al circuits; Al-SiC; Al-SiC composite plates; AlN; AlN ceramic plates; HEV; Pb; electric power control unit; high reliability; high-power module; hybrid electric vehicles; thermal resistance; thermally conductive stack; Artificial intelligence; Ceramics; Circuits; Copper; Costs; Hybrid electric vehicles; Lead; Multichip modules; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Vehicle Electronics Conference, 2001. IVEC 2001. Proceedings of the IEEE International

Conference_Location

Tottori

Print_ISBN

0-7803-7229-8

Type

conf

DOI

10.1109/IVEC.2001.961717

Filename

961717