DocumentCode
181377
Title
TCAD methodology for simulation of GaN-HEMT power devices
Author
Strauss, Severin ; Erlebach, Axel ; Cilento, Tommaso ; Marcon, Denis ; Stoffels, Steve ; Bakeroot, B.
Author_Institution
Synopsys Switzerland LCC, Zurich, Switzerland
fYear
2014
fDate
15-19 June 2014
Firstpage
257
Lastpage
260
Abstract
Gallium nitride (GaN) based High Electron Mobility Transistors (HEMTs) are candidates for the next generation of power electronic devices and are therefore subject of intense research activities worldwide. Technology CAD (TCAD) has proven a major impact on the optimization of silicon based device technologies. It is a logical follow up to provide accurate simulation tools, methods and models for GaN-based device technologies that are benchmarked against hardware data. This work presents a systematic investigation of GaN-HEMTs by TCAD, including process emulation, in plane and full stress simulation, and drift-diffusion device simulation.
Keywords
III-V semiconductors; elemental semiconductors; gallium; high electron mobility transistors; silicon; technology CAD (electronics); wide band gap semiconductors; GaN; HEMT; Si; TCAD methodology; drift-diffusion device simulation; full stress simulation; high electron mobility transistors; plane simulation; power electronic devices; process emulation; silicon based device technologies; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Materials; Solid modeling; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location
Waikoloa, HI
ISSN
1943-653X
Print_ISBN
978-1-4799-2917-7
Type
conf
DOI
10.1109/ISPSD.2014.6856025
Filename
6856025
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