DocumentCode :
181377
Title :
TCAD methodology for simulation of GaN-HEMT power devices
Author :
Strauss, Severin ; Erlebach, Axel ; Cilento, Tommaso ; Marcon, Denis ; Stoffels, Steve ; Bakeroot, B.
Author_Institution :
Synopsys Switzerland LCC, Zurich, Switzerland
fYear :
2014
fDate :
15-19 June 2014
Firstpage :
257
Lastpage :
260
Abstract :
Gallium nitride (GaN) based High Electron Mobility Transistors (HEMTs) are candidates for the next generation of power electronic devices and are therefore subject of intense research activities worldwide. Technology CAD (TCAD) has proven a major impact on the optimization of silicon based device technologies. It is a logical follow up to provide accurate simulation tools, methods and models for GaN-based device technologies that are benchmarked against hardware data. This work presents a systematic investigation of GaN-HEMTs by TCAD, including process emulation, in plane and full stress simulation, and drift-diffusion device simulation.
Keywords :
III-V semiconductors; elemental semiconductors; gallium; high electron mobility transistors; silicon; technology CAD (electronics); wide band gap semiconductors; GaN; HEMT; Si; TCAD methodology; drift-diffusion device simulation; full stress simulation; high electron mobility transistors; plane simulation; power electronic devices; process emulation; silicon based device technologies; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Materials; Solid modeling; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
ISSN :
1943-653X
Print_ISBN :
978-1-4799-2917-7
Type :
conf
DOI :
10.1109/ISPSD.2014.6856025
Filename :
6856025
Link To Document :
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