• DocumentCode
    181377
  • Title

    TCAD methodology for simulation of GaN-HEMT power devices

  • Author

    Strauss, Severin ; Erlebach, Axel ; Cilento, Tommaso ; Marcon, Denis ; Stoffels, Steve ; Bakeroot, B.

  • Author_Institution
    Synopsys Switzerland LCC, Zurich, Switzerland
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    257
  • Lastpage
    260
  • Abstract
    Gallium nitride (GaN) based High Electron Mobility Transistors (HEMTs) are candidates for the next generation of power electronic devices and are therefore subject of intense research activities worldwide. Technology CAD (TCAD) has proven a major impact on the optimization of silicon based device technologies. It is a logical follow up to provide accurate simulation tools, methods and models for GaN-based device technologies that are benchmarked against hardware data. This work presents a systematic investigation of GaN-HEMTs by TCAD, including process emulation, in plane and full stress simulation, and drift-diffusion device simulation.
  • Keywords
    III-V semiconductors; elemental semiconductors; gallium; high electron mobility transistors; silicon; technology CAD (electronics); wide band gap semiconductors; GaN; HEMT; Si; TCAD methodology; drift-diffusion device simulation; full stress simulation; high electron mobility transistors; plane simulation; power electronic devices; process emulation; silicon based device technologies; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Materials; Solid modeling; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6856025
  • Filename
    6856025