Title :
Power module in package with stack configuration of the EZ-pair MOSFETs and its dual gate driver
Author :
Xiaotian Zhang ; Pan, Jeng-Shyang ; Tomas, Mark ; Jun Lu ; Yilmaz, Hamza ; Lu, R. ; Zach Zhang ; Yueh-Se Ho ; Ji Pan
Author_Institution :
Alpha & Omega Semicond., Inc., Sunnyvale, CA, USA
Abstract :
This paper presents an innovative surface mount bottom power ground device consisting of a dual gate driver and two optimized MOSFETs in a single package to produce a high efficiency DC-DC synchronous buck power stage. The paper illustrates the structure of the new technology, novel assembly method, characterization of device, and explains the benefits of packaging technology in a DC-DC converter application. This device enables high power density voltage regulator solutions ideal for notebook PCs, servers, and graphic cards applications.
Keywords :
DC-DC power convertors; MOSFET; driver circuits; voltage regulators; DC-DC converter application; DC-DC synchronous buck power stage; EZ-pair MOSFET; dual gate driver; high power density voltage regulator solutions; optimized MOSFET; packaging technology; surface mount bottom power ground device; Assembly; Integrated circuits; Logic gates; MOSFET; Packaging; Silicon; Thermal loading;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-4799-2917-7
DOI :
10.1109/ISPSD.2014.6856042
