• DocumentCode
    181433
  • Title

    Impacts of conduction band offset and border traps on Vth instability of gate recessed normally-off GaN MIS-HEMTs

  • Author

    Woojin Choi ; Hojin Ryu ; Namcheol Jeon ; Minseong Lee ; Neung-Hee Lee ; Kwang-Seok Seo ; Ho-Young Cha

  • Author_Institution
    Electr. & Comput. Eng., Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2014
  • fDate
    15-19 June 2014
  • Firstpage
    370
  • Lastpage
    373
  • Abstract
    An investigation of threshold voltage instability in gate recessed normally-off GaN metal insulator semiconductor high electron mobility transistors (MIS-HEMTs) was performed by analyzing the interface states, border traps, and conduction band offset. To reduce the threshold voltage instability with improved dielectric-GaN interface, plasma enhanced atomic layer deposition (PEALD) technique was successfully employed for very thin SiNx (5nm) as an interfacial layer. Forward biased gate leakage current, capacitance-voltage measurements, and current-transient analysis were performed to find the reason for this improvement. Finally, we proposed an importance of border traps and the conduction band offset which is related to trapping mechanism in transfer characteristics.
  • Keywords
    III-V semiconductors; MISFET; atomic layer deposition; conduction bands; gallium compounds; high electron mobility transistors; interface states; leakage currents; plasma deposition; transient analysis; wide band gap semiconductors; GaN; PEALD technique; border traps; capacitance-voltage measurements; conduction band offset; current-transient analysis; forward biased gate leakage current; gate recessed normally-off MIS-HEMTs; interface state analysis; interfacial layer; metal insulator semiconductor high electron mobility transistors; plasma enhanced atomic layer deposition; threshold voltage instability; transfer characteristics; trapping mechanism; Electron traps; Gallium nitride; Hysteresis; Logic gates; Silicon compounds; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
  • Conference_Location
    Waikoloa, HI
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4799-2917-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2014.6856053
  • Filename
    6856053