Title :
SOI-based devices and technologies for High Voltage ICs
Author_Institution :
Univ. of Cambridge, Cambridge
fDate :
Sept. 30 2007-Oct. 2 2007
Abstract :
This paper reviews the current status Silicon-On-Insulator (SOI) devices and technologies for high voltage integrated circuits (HVICs) and discusses new trends in the field. The paper focuses on novel SOI-based RESURF concepts such as superjunction, linearly graded profile or SOI membrane technology. Due to its intrinsic isolation properties, the SOI is the ideal substrate for bipolar MOS switches such as the LIGBT. In fact, the only LIGBT products on the market are fabricated using Dielectric Isolation (type of SOI) and SOI technology. The paper finishes with an overview of the fierce fight of technology survival in terms of specific Ron vs breakdown voltage. Here the SOI competes with quasi-vertical DMOS technologies and advanced bulk BCD technologies.
Keywords :
bipolar integrated circuits; insulated gate bipolar transistors; power integrated circuits; power semiconductor switches; silicon-on-insulator; LDMOSFET; LIGBT; RESURF concepts; SOI-based devices; advanced bulk BCD technologies; bipolar MOS switches; dielectric isolation; high voltage IC; high voltage integrated circuits; intrinsic isolation properties; power IC; quasivertical DMOS technologies; silicon-on-insulator devices; specific Ron; CMOS technology; Dielectric substrates; Integrated circuit technology; Isolation technology; Leakage current; Power integrated circuits; Silicon on insulator technology; Temperature; Ultra large scale integration; Voltage; High Voltage Integrated Circuits; LDMOSFET; LIGBT; Power ICs; SOI technology;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2007. BCTM '07. IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-1019-4
Electronic_ISBN :
1088-9299
DOI :
10.1109/BIPOL.2007.4351842