Title :
A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications
Author :
Uchida, Seiichi ; Kaeriyama, Shunichi ; Nagase, Hirokazu ; Takeda, Kenji ; Nakashiba, Yasutaka ; Maeda, T. ; Ishihara, Koichi
Author_Institution :
Renesas Electron. Corp., Kawasaki, Japan
Abstract :
A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7 kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5 kV is estimated by extrapolation of time-dependent dielectric breakdown results.
Keywords :
electric breakdown; motor drives; three-dimensional integrated circuits; automotive motor drive; breakdown voltage; coil magnetic coupling; die attach film; digital isolator; face-to-face chip stacking isolator structure; industrial motor drive; insulation voltage; receiver chips; time 20 year; time-dependent dielectric breakdown; transmitter chips; voltage 1.5 kV; voltage 7 kV; Breakdown voltage; Insulation; Isolators; Power transformer insulation; Semiconductor device measurement; Stacking; Voltage measurement;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on
Conference_Location :
Waikoloa, HI
Print_ISBN :
978-1-4799-2917-7
DOI :
10.1109/ISPSD.2014.6856071
