A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications

Author

Uchida, Seiichi ; Kaeriyama, Shunichi ; Nagase, Hirokazu ; Takeda, Kenji ; Nakashiba, Yasutaka ; Maeda, T. ; Ishihara, Koichi

Author_Institution

Renesas Electron. Corp., Kawasaki, Japan

fYear

2014

fDate

15-19 June 2014

Firstpage

442

Lastpage

445

Abstract

A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7 kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5 kV is estimated by extrapolation of time-dependent dielectric breakdown results.

Keywords

electric breakdown; motor drives; three-dimensional integrated circuits; automotive motor drive; breakdown voltage; coil magnetic coupling; die attach film; digital isolator; face-to-face chip stacking isolator structure; industrial motor drive; insulation voltage; receiver chips; time 20 year; time-dependent dielectric breakdown; transmitter chips; voltage 1.5 kV; voltage 7 kV; Breakdown voltage; Insulation; Isolators; Power transformer insulation; Semiconductor device measurement; Stacking; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices & IC's (ISPSD), 2014 IEEE 26th International Symposium on

Conference_Location

Waikoloa, HI

ISSN

1943-653X

Print_ISBN

978-1-4799-2917-7

Type

conf

DOI

10.1109/ISPSD.2014.6856071

Filename

6856071