Micropackaging technologies for optoelectronic components

Author

Hall, J.P. ; Kearley, M.Q. ; Moseley, A.J. ; Goodwin, M.J.

Author_Institution

GEC-Marconi Mater. Technol., Towcester, UK

fYear

1994

fDate

34382

Firstpage

42614

Lastpage

42619

Abstract

The application of micropackaging technologies for optoelectronic devices is driven by the need to reduce assembly costs which are currently dominated by the fibre interfacing, which involves the accurately positioning and fixing of an optical fibre in a critical alignment to the optoelectronic chip. The use of microetched silicon components for chip carriers with V-grooves for passive fibre positioning and solder bump technology for chip positioning and electrical interfacing is described. Examples for telecommunications and data communications applications include a hybrid transceiver multi-chip module combining optoelectronics with electronic components, and an optoelectronic integrated circuit (OEIC) interfaced to single mode fibre

Keywords

etching; integrated optoelectronics; multichip modules; optical communication equipment; optical couplers; optical fibres; packaging; soldering; transceivers; V-grooves; assembly costs; chip carriers; chip positioning; electrical interfacing; elemental semiconductor; hybrid transceiver multi-chip module; microetched Si components; micropackaging technologies; optoelectronic components; optoelectronic integrated circuit; passive fibre positioning; single mode fibre; solder bump technology;

fLanguage

English

Publisher

iet

Conference_Titel

Microengineering and Optics, IEE Colloquium on

Conference_Location

London

Type

conf

Filename

286137