Title :
A microcomputer thermal analysis of a Gunn diode in microstrip circuits
Author :
Tseng, Ampere A.
Author_Institution :
Drexel Univ., Philadelphia, PA, USA
Abstract :
A microcomputer finite-element code has been used to analyze the steady-state thermal behavior of a microstrip Gunn diode circuit with the goal of reducing the device temperature by varying microstrip thicknesses. Although the microstrip is designed mainly for electronic purposes, the analysis has shown that it can also provide a favorable thermal environment to alleviate the device temperature. A two-step modeling approach that can reduce the computer memory needed for computation was used to allow the present study to be conducted on a microcomputer. In this approach, the temperature increases in the device and in the heat sink are considered separately. The device temperature is analyzed by the microcomputer finite-element technique. The heat-sink resistance is calculated by simplified analytical schemes
Keywords :
Gunn diodes; electronic engineering computing; finite element analysis; heat sinks; microcomputer applications; semiconductor device models; solid-state microwave circuits; strip line components; thermal analysis; Gunn diode; device temperature; finite-element code; heat-sink resistance; microcomputer thermal analysis; microstrip circuits; solid state microwave devices; steady-state thermal behavior; two-step modeling approach; Circuits; Diodes; Finite element methods; Gunn devices; Heat sinks; Microcomputers; Microstrip; Resistance heating; Steady-state; Temperature;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28671
