Thermal advantages of a new microcircuit configuration

Author

Pestorius, T.D. ; Gregory, V. ; Kraus, A.D.

Author_Institution

Dynametrics Electron., McClean, VA, USA

fYear

1988

fDate

11-13 May 1988

Firstpage

33

Lastpage

36

Abstract

A comparison is made of two different microcircuit package configurations, a traditional ceramic and kovar steel package is compared to ultrathin polyimide/polyetherimide which is cast directly on a copper foil and laminated to an aluminum plate. The comparison is in the form of a thermal analysis. It shows that the aluminum plate with the thin dielectric is superior from a thermal management standpoint. It is expected that this combination will also provide cost and weight advantages over the more traditional materials as well

Keywords

integrated circuit technology; packaging; thermal analysis; Al plate; Cu foil; Cu-Al; ceramic-kovar steel package; microcircuit package configurations; thermal analysis; thermal management; thin dielectric; ultrathin polyimide/polyetherimide; Aluminum; Copper; Costs; Dielectric materials; Electronic packaging thermal management; Electronics cooling; Polyimides; Thermal conductivity; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28674

Filename

28674