Title :
Thermal advantages of a new microcircuit configuration
Author :
Pestorius, T.D. ; Gregory, V. ; Kraus, A.D.
Author_Institution :
Dynametrics Electron., McClean, VA, USA
Abstract :
A comparison is made of two different microcircuit package configurations, a traditional ceramic and kovar steel package is compared to ultrathin polyimide/polyetherimide which is cast directly on a copper foil and laminated to an aluminum plate. The comparison is in the form of a thermal analysis. It shows that the aluminum plate with the thin dielectric is superior from a thermal management standpoint. It is expected that this combination will also provide cost and weight advantages over the more traditional materials as well
Keywords :
integrated circuit technology; packaging; thermal analysis; Al plate; Cu foil; Cu-Al; ceramic-kovar steel package; microcircuit package configurations; thermal analysis; thermal management; thin dielectric; ultrathin polyimide/polyetherimide; Aluminum; Copper; Costs; Dielectric materials; Electronic packaging thermal management; Electronics cooling; Polyimides; Thermal conductivity; Thermal management; Thermal management of electronics;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28674
